Specifications :

This Section gives the overview of various specifications used in this industry. The old mil specs. are now discontinued and IPC specs. are the governing documents. The main IPC document is IPC-6013B. (show the pdf.)

IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-DD-135 Qualification for Deposited Organic Inter-layer Dielectric Materials for Multichip Modules

IPC-CF-148 Resin Coated Metal for Printed Boards

IPC-D-325 Documentation Requirements for Printed Wir ing

IPC-A-600 Acceptability of Printed Boards

IPC-TM-650 Test Methods Manual
2.1.1 Microsectioning
2.1.1.2 Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)
2.3.15 Purity, Copper Foil or Plating
2.3.38 Surface Organic Contaminant Detection List
2.3.39 Surface Organic Contaminant Identification Test (Infrared Analytical Method)
2.4.1 Adhesion, Tape Testing 2.4.2.1 Flexural Fatigue and Ductility, Foil
2.4.3 Flexural Fatigue, Flexible Printed Wiring Mate rials
2.4.3.1 Flexural Fatigue and Ductility, Flexible Printed Wiring
2.4.18.1 Tensile Strength and Elongation, In-House Plat ing
2.4.20 Terminal Bond Strength, Flexible Printed Wiring
2.4.22 Bow and Twist
2.4.28.1 Adhesion, Solder Resist (Mask) Tape Test Method
2.4.36 Rework Simulation, Plated-Through Holes for Leaded Components
2.4.41.2 Coefficient of Thermal Expansion - Strain Gage Method
2.5.7 Dielectric Withstand Voltage, PWB
2.5.5.7 Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR.
2.6.1 Fungus Resistance Printed Wiring Materials
2.6.3 Moisture and Insulation Resistance, Printed Boards
2.6.4 Outgassing, Printed Boards
2.6.7.2 Thermal Shock and Continuity, Printed Boards
2.6.8 Thermal Stress, Plated-Through Holes
IPC-QL-653 Qualification of Facilities that Inspect/Test Printed Boards, Components and Materials
IPC-SM-840 Qualification and Performance of Permanent Solder Mask
IPC-2221 Generic Standard on Printed Board Design
IPC-2223 Sectional Design Standard for Flexible Printed Boards
IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits
IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-4103 Specifications for Base Materials for High Speed / High Frequency Applications
IPC-4202 Flexible Bare Dielectrics for use in Flexible Printed Wiring
IPC-4203 Adhesive Coated Dielectrics Films for Use in Fabrication of Flexible Printed Wiring
IPC-4204 Metal-Clad Flexible Dielectrics for Use in Fab rication of Flexible Printed Wiring
IPC-4552 Electroless Nickel/Immersion Gold Plating for Electronic Interconnections
IPC-4553 Specification for Immersion Silver Plating for Printed circuit Boards.
IPC-4562 Copper Foil for Printed Wiring Applications
IPC-6011 Generic Performance Specification for Printed Boards
IPC-7711/21A Rework and Repair Guide
IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

2.2 Joint Industry Standards

J-STD-003 Solderability Tests for Printed Boards

J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders
for Elec tronic Soldering Applications

2.3 Federal

SAE-AMS-QQ-N-290 Nickel Plating (Electrodeposited)

2.4 American Society for Testing and Materials

ASTM B 488 Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses
ASTM B 579 Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy

2.5 National Electrical Manufacturers Association

NEMA LI-1 Industrial Laminate Thermosetting Product

2.6 American Society for Quality

H0862 Zero Acceptance Number Sampling Plans

Downloads and Important Links

IPC download 6013B

http://www.ipc.org/TOC/IPC-6013B.pdf

IPC free downloads
http://www.ipc.org/contentpage.aspx?pageid=IPC-Free-Documents

IPC Specification Tree by Dynamix Technology
http://www.dynamixtechnology.com/docs/ipcspectree.pdf

The current 50884 mil spec documents can be downloaded from DSCC web site
http://www.dscc.dla.mil/Downloads/MilSpec/Docs/MIL-P-50884/mil50884.pdf

link for PCB007- FCT Handbook and addendum.