PRODUCTS MANUFACTURED

• Rigid Flex
• Flexible Circuits
• Single Sided / Double Sided
• Multi-Layer
• Reverse Bare
• Flying Leads (Unsupported leads)

MATERIAL TYPES

• Acrylic / Kapton (UL 94 V 1)
• Modified Acrylic / Kapton (UL 94 V 0)
• Butyral Phenolic / Kapton ( UL 94 V 1)
• Butyral Phenolic / Upilex ( UL 94 V 1)
• Flexible Epoxy / Kapton (UL 94 V 0)
• Ohmega / Kapton
• Adhesiveless Kapton
• Sputtered Copper
• Cast Polyimide
• Coated Polyimide

ADDITIONAL SERVICES AVAILBLE

• Bed Of Nails Testing
• Clam Shell Testing
• Flying Grid Testing
• Ionic Contaminant

DELIVERIES

• Production Run - Lead Time
• Prototype (Expedite) - 1-2 days
• Prototype (Typical) - 2-5 days
• Short Run(15-150 units) - 1-4 weeks
• Medium Run(150-10k units) - 2-4 weeks
• High Volume Per schedule

OPERATIONS CAPABILTIES

• Deep Gold
• Flexible Solder Mask(Screenable & LPI)
• Carbon Ink
• Fine Lines/High Density
• Solder Mask Over Bare Copper
• Kapton / FR -4 Stiffener
• Bright Tin Process

SPECIAL TECHNOLOGIES

• Electroless Tin
• Silver Epoxy Shielding
• Heat Sink Bonding
• ZerFlow Lamination
• Immersion Gold / Nickel
• Selective Gold / Solder
• Bright Tin
• High Precision True Position Tolerances
• Selective Pad Plating
• Volume Production With 5 micron copper
• Proprietary Ultra Flex Process
• Patented Rigid - Flex Process
• Buried Resistors (Ohmega Process)
• Laser Skive / Laser Trim

Testing

• X-Ray Inspection
• Cross Sections
• Optical Inner Layer Inspection
• Net List Testing
• PhotPlotting
• Dimensional Analysis
• XRF reports