Technology


PRODUCTS MANUFACTURED

  • Rigid Flex
  • Flexible Circuits
  • Single Sided / Double Sided
  • Multi-Layer
  • Reverse Bare
  • Flying Leads (Unsupported leads)
  • Rigid Flex
  • Flexible Circuits
  • Single Sided / Double Sided
  • Multi-Layer
  • Reverse Bare
  • Flying Leads (Unsupported leads)

MATERIAL TYPES

  • Acrylic / Kapton (UL 94 V 1)
  • Modified Acrylic / Kapton (UL 94 V 0)
  • Butyral Phenolic / Kapton ( UL 94 V 1)
  • Butyral Phenolic / Upilex ( UL 94 V 1)
  • Flexible Epoxy / Kapton (UL 94 V 0)
  • Ohmega / Kapton
  • Adhesiveless Kapton
  • Sputtered Copper
  • Cast Polyimide
  • Coated Polyimide

OPERATIONS CAPABILTIES

  • Deep Gold
  • Flexible Solder Mask(Screenable & LPI)
  • Carbon Ink
  • Fine Lines/High Density
  • Solder Mask Over Bare Copper
  • Kapton / FR -4 Stiffener
  • Bright Tin Process

SPECIAL TECHNOLOGIES

  • Electroless Tin
  • Silver Epoxy Shielding
  • Heat Sink Bonding
  • ZerFlow Lamination
  • Immersion Gold / Nickel
  • Selective Gold / Solder
  • Bright Tin
  • High Precision True Position Tolerances
  • Selective Pad Plating
  • Volume Production With 5 micron copper
  • Proprietary Ultra Flex Process
  • Patented Rigid – Flex Process
  • Buried Resistors (Ohmega Process)
  • Laser Skive / Laser Trim

OPERATIONS CAPABILTIES

  • Deep Gold
  • Flexible Solder Mask(Screenable & LPI)
  • Carbon Ink
  • Fine Lines/High Density
  • Solder Mask Over Bare Copper
  • Kapton / FR -4 Stiffener
  • Bright Tin Process

ADDITIONAL SERVICES AVAILABLE

  • Bed Of Nails Testing
  • Clam Shell Testing
  • Flying Grid Testing
  • Ionic Contaminant

DELIVERIES

Production Run – Lead Time

  • Prototype (Expedite) – 1-2 days
  • Prototype (Typical) – 2-5 days
  • Short Run(15-150 units) – 1-4 weeks
  • Medium Run(150-10k units) – 2-4 weeks
  • High Volume Per schedule

TESTING

  • X-Ray Inspection
  • Cross Sections
  • Optical Inner Layer Inspection
  • Net List Testing
  • PhotPlotting
  • Dimensional Analysis
  • XRF reports